Peng Li

EDITORIAL BOARD

Postal Code: 230026, 96 Jinzhai Street, Hefei, China
Office: +86-551-63607785
Email: lipeng18@ustc.edu.cn


EDUCATION

  • Doctor of Philosophy — May 2014 University of Notre Dame, Electrical Engineering — Notre Dame, Indiana

  • Master of Engineering — June 2009 Huazhong University of Science & Technology, Electronic Science & Technology — Wuhan, China

  • Bachelor of Engineering — June 2007 Huazhong University of Science & Technology, Electronic Science & Technology — Wuhan, China


WORK EXPERIENCE

Professor — University of Science & Technology of China, School of Microelectronics — 2022.1–Present
Assistant Professor — Auburn University, Electrical & Computer Engineering — 2019.8–2021.12
Postdoctoral Fellow — Stanford University, Department of Applied Physics — 2018.2–2019.8
Colorado State University, Department of Physics — 2016.10–2018.2
Colorado State University, Department of Physics — 2014.5–2015.6
Visiting Scientist — Argonne National Laboratory, MSD Division — 2016–2021
Senior Engineer — Seagate Technology, Head Research Center — 2015.6–2016.10


TEACHING EXPERIENCE

2018.8–2021.12 — Microelectronics, University of Science & Technology of China — Student Evaluation
 VLSI Process (ELEC5303P.02) — 86/100

2018.8–2021.12 — Electrical & Computer Engineering, Auburn University — Student Evaluation
 Microelectronic Fabrication (ELEC 5730/6730) — 5.5/6

2014.1–2015.6 — Department of Physics, Colorado State University
 General Physics (PH141) — Good
 Electricity and Magnetism (PH351) — Good


HONORS

  • Ralph E. Powe Junior Faculty Enhancement Award

  • Shaheen Award Nominee, University of Notre Dame

  • Professional Development Award, University of Notre Dame


PROFESSIONAL SERVICE

  • IEEE Transactions on Quantum Engineering — Associate Editor

  • IEEE Magnetics Letters — Senior Editorial Board Member

  • IEEE Magnetics Society Education Committee — Treasurer

  • National Science Foundation (U.S.) — Reviewer and Panelist

  • National Science Foundation (Republic of Georgia) — Reviewer

  • Stanford Topological Insulator Consortium — Vice President

  • IEEE International Magnetics Conference — Technical Committee Member

  • Annual Conference on Magnetism & Magnetic Materials — Technical Committee Member


ISSN 3093-8686 (Online)